No Clean Flux -EO-S-018
EO‑S‑018 was designed to meet the requirements of lead stringers (soldering machines using lead‑based alloys) widely used in Asia. It is completely free of resin and rosin, eliminating any clogging of nozzles, pumps and tanks. The activators are dicarboxylic acids, halogen‑free, ensuring effective oxide removal even at high temperatures. The solids content is low and the residues remain dry and non‑sticky after soldering.
Chemical insight
The absence of resin/rosin removes the main source of fouling in lead‑based soldering equipment. The dicarboxylic acids are thermally stable and withstand temperature spikes without decomposing into corrosive by‑products. The flux evaporates cleanly, leaving a film of non‑adherent residues
What lies behind the chemical composition
- Solvent base: isopropyl alcohol
- Solids content: low
- Activator system: dicarboxylic acids (resin‑free, rosin‑free)
- Halogen‑free
- Classification: ORL0 / NO CLEAN
What this means for you – concrete benefits for your process and quality (added value of EO‑S‑018)
- Specialised for Chinese lead stringers: formulation validated on Asian machines using SnPb alloys – no adaptation needed.
- Zero fouling: resin/rosin‑free – reduced downtime for cleaning nozzles and pumps.
- High temperature: activators withstand thermal peaks without loss of effectiveness.
- Dry residues: even after intensive cycles, residues do not stick to equipment.
TOPCon protection: halogen‑free – safety for the tunnel oxide


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