Solder Paste Low Temperature
- KOKI T4AB58-HF360, Low Melting Point Lead Free Melting Point Lead Free Solder Paste Solder Paste
- Koki no-clean LEAD FREE solder paste
- KOKI T4AB58-HF360 | Low Temperature Paste
Reliable and workable in low temperature reflow
Energy-saving
By reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.
Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care.
■ Electricity consumption / hr.during reflow process(kw)
Reduces thermal damage to components and substrate
Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.
■ Joint conditions after reflow
High insulation reliability
The flux solvent volatilizes even in low temperature reflow, eliminating reduction in insulation resistance arising from inadequate volatilization. TB48-M742・T4AB48/58-M742 produces flux residue with high insulation reliability.
■ Voltage applied SIR
Solder Paste Low Temperature KOKI T4AB58-HF360
- PERFECT MELTING and wetting at super fine pitch ( and wetting at super fine pitch (>0.4mm pitch) and 0.4mm pitch) and micro components (>0.3mm micro components (>0.3mm dia CSP, 0603 chip). CSP, 0603 chip).
- Specially formulated flux chemistry ensures extremely Specially formulated flux chemistry ensures extremely LOW VOIDING with CSPs and broad contact area components. and broad contact area components.
- KOKI T4AB58-HF360, Low Melting Point Lead Free Melting Point Lead Free Solder Paste Solder Paste
- Solder alloy composition is Sn-Ag0.4-Bi57.6 ( T4AB58-HF360 )
- KOKI Low Melting Point Solder Paste
Solder Paste Low Temperature KOKI T4AB58-HF360
| Application | Printing – Stencil | |
| Product | T4AB58-HF360 | |
| Alloy | Alloy Composition (%) | Sn-Ag0.4-Bi57.6 |
| Melting point (°C) | 138 | |
| Shape | Spherical | |
| Particle size (μm) | 20 – 38 | |
| Flux | Halide content (%) | 0 |
| Flux type | ROL0 | |
| Product | Flux content (%) | 10.0±1.0 |
| Viscosity (Pa.S) | 190±30 | |
| Copper plate corrosion*2 | Passed | |
| Tack time | > 16 hours | |
| Shelf Life (0-10ºC) | 6 months | |
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