KOKI S1XBIG58-M500-4 | Lead Free Solder Paste
PERFECT MELTING and wetting at super fine pitch micro components (>0.25mm dia. CSP, 0603 chip).
High-reliability Low Ag Lead Free Solder Paste
Koki S1XBIG58-M500-4 no-clean LEAD FREE solder paste
Achieved joint reliability superior to SAC305
The only difference from SAC305 is “low cost”
A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.
■ Alloy matrix
Maintains thermal-fatigue resistance for a long time
IMCs containing Ni (yellow points in the diagram on the right) finely disperse among Sn crystals and prevents growth of Sn crystals due to thermal shocks. Therefore, S1XBIG/S01XBIG makes a clear distinction from SAC305 also for its “long-lasting robustness” not just temporary withstandability.
■ Solder joint diagram (After 1500 cycles of -30 +/-80℃)
Reflow profile of SAC305 applicable
The melting point of S1XBIG is 211-223oC. By adding KOKI’s newly developed flux into the mix, the temperature profile of SAC305 has become applicable to S1XBIG. S1XBIG is flexible solder paste which is low in Ag yet has workability as high as conventional products.
Solder alloy composition is Sn 1.1Ag 0.7Cu 1.8Bi +Ni.
- HIGH RELIABILITY Low-Ag Alloy compared with conventional low-Ag alloys.
- PERFECT MELTING and wetting at super fine pitch micro components (>0.25mm dia. CSP, 0603 chip).
- Stable viscosity performance due to prevention with chemical reaction between solder powder and flux.
- Liquidus point (223ºC) may allow to apply the CONVENTIONAL reflow profile for SAC305.
- Conforms to HALOGEN FREE standard (Cl+Br = Less than 1500ppm) BS EN14582.
| Application | Printing – Stencil | |
| Product | S1XBIG58-M500-4 | |
| Alloy | Alloy Composition (%) | Sn 1.1Ag 0.7Cu 1.8Bi +Ni |
| Melting point (°C) | 211 – 223 | |
| Shape | Spherical | |
| Particle size (μm) | 20 – 38 | |
| Flux | Halide content (%) | 0.0 |
| Flux type | ROL0 | |
| Product | Flux content (%) | 11.2 ±1.0 |
| Viscosity*1 (Pa.S) | 220 ± 30 | |
| Copper plate corrosion*2 | Passed | |
| Tack time | > 24 hours | |
| Shelf Life (0-10ºC) | 6 months | |
| Optional powder size (µm) | 20 – 45: S1XBIG58-M500 | |
Reviews
There are no reviews yet.