Leaded Solder Paste SS58-M955LV Koki
Koki no-clean Leaded solder paste
KOKI Leaded Yellow Paste
Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
KOKI SS58-M955LV Low voiding type. Reduces voiding regardless of component type, such as BGA and PwTr
Leaded Solder Paste SS58 Koki
Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
Specifications – Alloy selections
Print-ability
Sharp print definition
Wettability
Excellent wetting
Voiding property (PwTr)
Conventio nal SS58-M955LV
- Solder alloy composition is Sn 36Pb 2
- Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
- Conforms to Bellcore tests (Copper Mirror, Halides, Surface Insulation Resistance, Electro migration) GR-78-CORE, Issue 1.
- Extremely long stencil idle time and tack time offers a wide process window.
- Uses carefully classified solder powder with uniform particle size.
- Carefully selected flux chemistry ensures low voids formation.
- Low color flux residue offers superior cosmetic appearance.
- Superior workability, solderability and electrical reliability.
- Applicable for super fine pitch SMT.
| Application | Printing – Stencil | |
| Product | SS58-955LV | |
| Alloy | Composition (%) | Sn62, Pb36, Ag2 |
| Melting point (°C) | 179-190 | |
| Shape | Spherical | |
| Particle size (μm) | 20 – 38 | |
| Flux | Halide content (%) | 0.0 |
| Flux type | ROL0 | |
| Product | Flux content (%) | 10 ± 0.5 |
| Viscosity*1 (Pa.S) | 200 ± 10% | |
| Copper plate corrosion*2 | Passed | |
| Tack time | > 36 hours | |
| Shelf life (below 10°C) | 6 months | |
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