KOKI SSA48-M955 Leaded Solder Paste
Koki no-clean Leaded solder paste
KOKI Leaded Yellow Paste
KOKI SSA48 Carefully selected thixotropic materials ensure excellent slump resistivity and significantly reduced occurrence of bridging and solder beading.
KOKI SSA48 Leaded Solder Paste , Ensures outstanding continual printability with fine pitch (0.5mm/20mil) and even super fine pitch.
KOKI SSA48 Solder Paste
A small percentage of antimony (Sb) reduces the wetting tension forces and as a result, effectively drastically reduces tombstoning.
Specifications – Alloy selections
Printability
0.4mm pitch (30th print)
Wettiing
NiFe QFP lead (SnPb plating) 1608 resistor
Self-alignment
To see the strength of wetting tension, which could cause tombstoning, the components, were mounted at angles of 0°, 10°, 20°, 30°, and 40°.
KOKI SSA48-M955 Anti Tombstone Leaded Solder Paste
- Ensures outstanding continual printability with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) applications at slow to fast (20-100mm/sec.) print speed, combined with long stencil idle time.
- Carefully selected thixotropic materials ensure excellent slump resistivity and significantly reduced occurrence of bridging and solder beading.
- To see the strength of wetting tension, which could cause tombstoning, the components, were mounted at angles of 0°, 10°, 20°, 30°, and 40°.
- A small percentage of antimony (Sb) reduces the wetting tension forces and as a result, effectively drastically reduces tombstoning.
- Specially developed flux system ensures both extremely high reliability and superior solder wetting.
- Extremely long stencil and tack time offers a wide process window.
| Application | Printing – Stencil | ||
| Product | SSA48-M955LV | ||
|
Alloy |
Composition (%) | Sn62.6, Pb36.8, Ag0.4, Sb0.2 | |
| Shape | Spherical | ||
| Melting point (°C) | 179-190 | ||
| Particle size (µm) | 20 – 45 | ||
|
Flux |
Halide content (%) | 0.0 | |
| Surface 12 insulation resistance *1 | Initial value (Ω) | > 1 × 10 | |
| After humidification (Ω) | > 1 × 1011 | ||
| Aqueous solution resistivity (Ω) | > 5 × 104 | ||
| Flux type | ROL0 | ||
| Product | Flux content (%) | 10 | |
| Viscosity*3 (Pa.S) | 200 | ||
| Copper plate corrosion | Passed | ||
| Solder spread factor (%) | 90 | ||
| Tack time | > 36 hours | ||
| Shelf life (below 10°C) | 6 months | ||
Reviews
There are no reviews yet.