KOKI SE58 Solder Paste | SE58-M955LV Leaded
Koki no-clean Leaded solder paste
KOKI Leaded Blue Paste
KOKI SE58-M955LV Outstanding continual and intermittent print-ability even with fine pitch pattern (0.4mm pitch, o.25mm∅) applications
Superior workability, solderability and electrical reliability.
Applicable for super fine pitch SMT production.
KOKI SE58 Solder Paste
Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
Specifications – Alloy selections
Performance of SE58-M955LV
Printability
Sharp print definition
Wettability
Excellent wetting
Voiding property (PwTr)
SE58-M955LV Conventional
Solder alloy composition is Sn37Pb
- Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
- Carefully selected flux chemistry ensures low voids formation.
- Extremely long stencil idle time and tack time offers a wide process window
- Low color flux residue offers superior cosmetic appearance.
- Conforms to Bellcore tests (Copper Mirror, Halides, Surface Insulation Resistance, Electro migration) GR-78-CORE, Issue 1.
- Uses carefully classified solder powder with uniform particle size.
- Superior workability, solderability and electrical reliability.
- Applicable for super fine pitch SMT production.
| Application | Printing – Stencil | |
| Product | SE-58-M955LV | |
| Alloy | Composition (%) | Sn63, Pb37 |
| Melting point (°C) | 183 | |
| Shape | Spherical | |
| Particle size (μm) | 20 – 38 | |
| Flux | Halide content (%) | 0.0 |
| Flux type | ROL0 | |
| Product | Flux content (%) | 10 ± 0.5 |
| Viscosity*1 (Pa.S) | 200 ± 10% | |
| Copper plate corrosion*2 | Passed | |
| Tack time | > 48 hours | |
| Shelf life (below 10°C) | 6 months | |
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