KOKI S3X58-M500C-5 | Lead Free Solder Paste
- KOKI S3X58-M500C-5 Powerful Wetting General Purpose Solder Paste
- Powerful Wetting Lead Free Solder Paste
- Koki no-clean LEAD FREE solder paste
Good and Consistent Wetting Spreading to Oxidized Metal Surface
Activator Technique
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
Low Voiding Technique
Solder Spreading Property
After continual print, pause 45 min. or 60 min. and resume printing and observe print volume.
Test condition
Stencil : 200μm / 6.5mmφ aperture
Pre-conditioning : 150ºC for 16Hr
Heat source : Convection reflow
Reflow : Air
Solder alloy composition is Sn 3.0Ag 0.5Cu
- EXCELLENT WETTING to severely oxidized patterns or components, such as oxidized Cu substrate, oxidized Sn and NiPd plating.
- PERFECT MELTING and wetting at super fine pitch (>0.4mm pitch) and micro components (>0.25mm dia CSP, 0603 chip).
- Specially formulated flux chemistry ensures EXTREMELY LOW VOIDING with CSPs and broad contact area components, e.g. QFN.
- Designed to prevent occurrence of HIDDEN PILLOW DEFECTS.
- Enables REUSE of leftover from previous day. Economical.
| Application | Printing – Stencil | |
| Product | S3X58-M500 | |
| Alloy | Alloy Composition (%) | Sn 3.0Ag 0.5Cu |
| Melting point (°C) | 217 – 219 | |
| Shape | Spherical | |
| Particle size (μm) | 20 – 38 | |
| Flux | Halide content (%) | 0 |
| Flux type | ROL0 | |
| Product | Flux content (%) | 11.5±1.0 |
| Viscosity (Pa.S) | 220±30 | |
| Copper plate corrosion*2 | Passed | |
| Tack time | > 48 hours | |
| Shelf Life (0-10ºC) | 6 months | |
| Optional powder size (µm) | 20 – 45; Product code S3X48-M500 | |
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