JS-EU.01 KOKI Flux | No Clean
Wave Soldering Flux JS-EU.01
An all-round liquid flux developed in pursuit of eliminating the defect modes peculiar to lead free soldering.
Excellent workability even with long dipping
By minimizing outflow of solid content due to the heat and pressure of waving, the rosin-free flux remains active until the end of the process. Realizes amazingly consistent solder workability.
High soldering quality
Thanks to the newly blended vehicle with excellent wettability on metal surfaces, it has achieved a thin and uniform flux layer.
Excellent wettability is realized by removing the OSP/Oxide film on the board pad in the preheating stage, securely prevention re-oxidization, and promptly spreading the active ingredients of the flux over the interface with the molten solder.
JS-EU-01 is made by special preparation which doesn’t use rosin at all, realizing a beautiful finish where flux residue after soldering is hardly visible.
QFP ( 0.8mm; 44pin)
Connecter & Transistor
Excellent total balance
- As far as a solution of the faulty soldering problem is concerned, the skewed improvement of a single characteristic ould rather break down the balance of the entire products, and lower performance consequently.
- JS-EU-01 is an excellent product in total balance without biases toward certain characteristics, reflecting improvement on existing products in each category which affects the soldering performance of any board and components.
JS-EU.01 KOKI Flux
New technology drastically reduces ball generation!
- Many solder balls are generated on the soldering surface because of the characteristics of lead-free solder, such as inferior solder wettability and cutoff punctuality.
- The balls cause a decline in the direct first time pass rate, or an increase in cleaning and adjustment costs.
- A trigger for ball generation may be ill-balanced flux fluidity and the solder wetting speed.
JS-EU.01 KOKI Flux
- Since the melting point of lead free solder is relatively higher than that of Sn/Pb solder, the fluidity of the solder deteriorates, as does the through-hole fill property decline significantly because of the high surface tension and the inferior solder wetting and spreading properties of the alloy.
- JS-EU-01 is a well balanced composition of various active materials to improve solder setting, and also enables fast and sure solder wetting by evenly providing enough sustained activity materials with positive “wetting of flux over the molten solder and pad interface” realized by the new blended flux vehicle “capable of evenly wetting thinly over the metal surfaces at ambient temperature and soldering temperature.
| Product | JS-EU.01 KOKI Flux | |
| Appearance | Colorless clear liquid | |
| Specific gravity (at 20°C) | 0.814 | |
| Non-volatile content (%) | 4.0 | |
| Halide content (%) | 0 | |
| Acid value (KOHmg/g) | 26.0 | |
| Flux type | ROL0 | |
| Solder spread factor*1 (%) | > 75 | |
| Application | Spray |
Reviews
There are no reviews yet.