DG Solder Paste Printer – Full Automatic Machine
DG Solder Paste Printer motor drives the squeegee connected to the screw to move up and down. automatic stencil cleaning system Frame size is adjustable.
5G
Semiconductor
DG Solder Paste Printer Full Automatic Machine
- Integrated molding structure of the entire machine frame
- Scraper upper and lower direct connection screw drive.
- Automatic intelligent cleaning system for steel mesh.
- Adjustable size of stencil frame.
- Classic Z-axis lifting platform.
- Printing cycle time 7s.
Solder paste monitoring system
The sensor under the front squeegee
detects the diameter of remaining solder paste and notifies customer to add solder paste.
Stencil aperture inspection system
Judgment of aperture plugging and notify
whether to clean the stencil. If the stencil inspection fails twice in a row, it will remind the customer whether to change the cleaning mode, cleaning frequency or perform manual cleaning.
Solder paste automatic adding
Automatic Supply Solder Paste
General solder paste pot add directly. Can be added at a fixed times
Automatic dispensing function
Automatic Dispensing Unit
Attached on CCD camera XY axis, the dispenser providers basic function of glue dotting using syringe type dispensing needle after solder printing
UPS power off protection
UPS
After power off in a certain time (10 minutes) PC can keep the power supply for the protection of production data.
Intelligent temperature control system
Temprature & Humidity control system
Temperature can be shown and adjustable on the overhead control and on the external control system.
| Parameters | Specification | ||||
| Model | DG | ||||
| Screen Frame Size | 470mm x 370mm~737mm x 737mm | ||||
| Substrate Handling Size (minimum) | 50mm (X) x 50mm (Y) | ||||
| Substrate Handling Size (maximum) | 400mm (X) x340mm (Y) Options:460mm(X)x340mm(Y) 510mm(X)x340mm(Y) |
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| Cycle Time | 7s | ||||
| Screen Frame Thickness | 20mm -40mm | ||||
| Substrate Thickness | 0.4mm -6mm | ||||
| Print Pressure | 0kg -20kg | ||||
| Print Speed | 1 -200mm/s | ||||
| Print Gap | 0mm -20mm | ||||
| Substrate Separation | Speed:0.1-20mm/sec Distance:0mm – 20mm |
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| Apply paste option | Solder paste，Printing ink, Silver paste | ||||
- Customized communication mode of customer to realize intelligent operation management.
- Productivity analysis and real-time statistical operation information function .
- Bar code recognition.
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