Automatic Solder Paste Printer – DGH Desen
Automatic Solder Paste Printer have Classic small platform for calibration system and Automatic multi-cleaning system for steel mesh
5G
Semiconductor
Automatic Solder Paste Printer Desen DGH
- Automatic multi-cleaning system for steel mesh.
- Classic small platform for calibration system.
- Automatic stencil positioning system.
- Max printing size: 400*340mm.
- Automatic top clamping.
- Printing cycle time 7s.
Solder paste monitoring system
The sensor under the front squeegee
detects the diameter of remaining solder paste and notifies customer to add solder paste.
Stencil aperture inspection system
Judgment of aperture plugging and notify
whether to clean the stencil. If the stencil inspection fails twice in a row, it will remind the customer whether to change the cleaning mode, cleaning frequency or perform manual cleaning.
Solder paste automatic adding
Automatic Supply Solder Paste
General solder paste pot add directly. Can be added at a fixed times
Automatic dispensing function
Automatic Dispensing Unit
Attached on CCD camera XY axis, the dispenser providers basic function of glue dotting using syringe type dispensing needle after solder printing
UPS power off protection
UPS
After power off in a certain time (10 minutes) PC can keep the power supply for the protection of production data.
Intelligent temperature control system
Temprature & Humidity control system
Temperature can be shown and adjustable on the overhead control and on the external control system.
| Parameters | Specification | ||||||
| Model | DGH | ||||||
| Screen Frame Size | 470mm x 370mm~737mm x 737mm | ||||||
| Substrate Handling Size (minimum) | 50mm (X) x 50mm (Y) | ||||||
| Substrate Handling Size (maximum) | 400mm (X) x340mm (Y) Options:460mm(X)x340mm(Y) 510mm(X)x340mm(Y) |
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| Cycle Time | 7s | ||||||
| Screen Frame Thickness | 20mm – 40mm | ||||||
| Substrate Thickness | 0.4mm – 6mm | ||||||
| Print Pressure | 0kg – 20kg | ||||||
| Print Speed | 1 – 200mm/s | ||||||
| Print Gap | 0mm – 20mm | ||||||
| Substrate Separation | Speed:0.1- 20mm/sec Distance:0mm – 20mm |
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| Apply paste option | Solder paste，Printing ink, Silver paste | ||||||
| Voltage | 220Volts +/- 10%.Single phase 50/60Hz | ||||||
- Customized communication mode of customer to realize intelligent operation management.
- Productivity analysis and real-time statistical operation information function.
- Intelligent Alarm system and solutions.
- Bar code recognition.
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